Exposure to ELF-MF differed among types of factory, operation, job and activity. The average levels of ELF-MF exposure were 0.56 µT for fab workers, 0.59 µT for chip packaging workers and 0.89 µT for electrical engineers, respectively. ELF-MF exposure of workers were classified based on the quartiles of ELF-MF distribution. All measurements were categorized by operation, job and working activity during working time.
A portable device was used to monitor ELF-MF in high temporal resolution. These were demonstrated by assessing the exposure of 117 workers involved in wafer fabrication (fab) and chip packaging wearing personal dosimeters for a full shift. We assessed the exposure of semiconductor workers to extremely low frequency-magnetic fields (ELF-MF) and identified job characteristics affecting ELF-MF exposure.
